雜志介紹

Microelectronics Journal雜志介紹

《Microelectronics Journal》是一本以English為主的未開放獲取國際優秀期刊，中文名稱微電子雜志，本刊主要出版、報道工程技術-ENGINEERING, ELECTRICAL & ELECTRONIC領域的研究動態以及在該領域取得的各方面的經驗和科研成果，介紹該領域有關本專業的最新進展，探討行業發展的思路和方法，以促進學術信息交流，提高行業發展。該刊已被國際權威數據庫SCIE收錄，為該領域相關學科的發展起到了良好的推動作用，也得到了本專業人員的廣泛認可。該刊最新影響因子為1.9，最新CiteScore 指數為4。

本刊近期中國學者發表的論文主要有：

• 16-Cell stackable battery monitoring and management integrated circuit for electric vehicles

  Author: Zhu, Guangqian; Qian, Libo; Li, Yongyuan; Guo, Wei; Ding, Ruixue; Yang, Yintang

• A wafer-level three-step calibration technique for BJT-based CMOS temperature sensor

  Author: Gao, Ying; Liu, Xin; Jiang, Yanfeng

• Scalable modeling of grounded coplanar waveguide for MMICs design using neural network with an effective sampling strategy

  Author: Hu, Yanghui; Zhang, Yuming; Lu, Hongliang; Tan, Daidao; Qi, Junjun

• A configurable area-efficient LCoS chip design with centrosymmetric pixel array

  Author: Zhao, Tianhu; Liang, Yuhua; Feng, Lichen

英文介紹

Microelectronics Journal雜志英文介紹

Published since 1969, the Microelectronics Journal is an international forum for the dissemination of research and applications of microelectronic systems, circuits, and emerging technologies. Papers published in the Microelectronics Journal have undergone peer review to ensure originality, relevance, and timeliness. The journal thus provides a worldwide, regular, and comprehensive update on microelectronic circuits and systems.

The Microelectronics Journal invites papers describing significant research and applications in all of the areas listed below. Comprehensive review/survey papers covering recent developments will also be considered. The Microelectronics Journal covers circuits and systems. This topic includes but is not limited to: Analog, digital, mixed, and RF circuits and related design methodologies; Logic, architectural, and system level synthesis; Testing, design for testability, built-in self-test; Area, power, and thermal analysis and design; Mixed-domain simulation and design; Embedded systems; Non-von Neumann computing and related technologies and circuits; Design and test of high complexity systems integration; SoC, NoC, SIP, and NIP design and test; 3-D integration design and analysis; Emerging device technologies and circuits, such as FinFETs, SETs, spintronics, SFQ, MTJ, etc.

Application aspects such as signal and image processing including circuits for cryptography, sensors, and actuators including sensor networks, reliability and quality issues, and economic models are also welcome.