雜志介紹

Circuit World雜志介紹

《Circuit World》是一本以English為主的未開放獲取國際優(yōu)秀期刊，中文名稱電路世界，本刊主要出版、報(bào)道工程技術(shù)-ENGINEERING, ELECTRICAL & ELECTRONIC領(lǐng)域的研究動(dòng)態(tài)以及在該領(lǐng)域取得的各方面的經(jīng)驗(yàn)和科研成果，介紹該領(lǐng)域有關(guān)本專業(yè)的最新進(jìn)展，探討行業(yè)發(fā)展的思路和方法，以促進(jìn)學(xué)術(shù)信息交流，提高行業(yè)發(fā)展。該刊已被國際權(quán)威數(shù)據(jù)庫SCIE收錄，為該領(lǐng)域相關(guān)學(xué)科的發(fā)展起到了良好的推動(dòng)作用，也得到了本專業(yè)人員的廣泛認(rèn)可。該刊最新影響因子為0.8，最新CiteScore 指數(shù)為2.6。

本刊近期中國學(xué)者發(fā)表的論文主要有：

• A compact broadband high power quasi-MMIC GaN power amplifier

  Author: Liu, Lin-sheng; Lin, Qian; Wu, Hai-Feng; Chen, Yi-Jun; Hu, Liu-Lin

• A self-powered ultra-low-power intermittent-control SSHI circuit for piezoelectric energy harvesting

  Author: Wang, Guoda; Li, Ping; Wen, Yumei; Luo, Zhichun

• Effects of additives on via filling and pattern plating with simultaneous electroplating

  Author: Sun, Zhihong; Wang, Jing

• Analysis, design and experimentation of high-pass negative group delay lumped circuit

  Author: Du, Hongyu; Yang, Rong; Gu, Taochen; Zhou, Xiang; Yazdani, Samar; Sambatra, Eric; Wan, Fayu; Lallechere, Sebastien; Ravelo, Blaise

英文介紹

Circuit World雜志英文介紹

Circuit World is a platform for state of the art, technical papers and editorials in the areas of electronics circuit, component, assembly, and product design, manufacture, test, and use, including quality, reliability and safety. The journal comprises the multidisciplinary study of the various theories, methodologies, technologies, processes and applications relating to todays and future electronics. Circuit World provides a comprehensive and authoritative information source for research, application and current awareness purposes.

Circuit World covers a broad range of topics, including:

? Circuit theory, design methodology, analysis and simulation

? Digital, analog, microwave and optoelectronic integrated circuits

? Semiconductors, passives, connectors and sensors

? Electronic packaging of components, assemblies and products

? PCB design technologies and processes (controlled impedance, high-speed PCBs, laminates and lamination, laser processes and drilling, moulded interconnect devices, multilayer boards, optical PCBs, single- and double-sided boards, soldering and solderable finishes)

? Design for X (including manufacturability, quality, reliability, maintainability, sustainment, safety, reuse, disposal)

? Internet of Things (IoT).